SERIAL
ITEM
TECHNICAL DATA
1
Layers
1-10 Layers
2
Max board size
450x660mm 18"x26"
3
Min Board Thickness
4 layers 0.40mm 16mil
6 layers 1.00mm 40mil
8 layers 1.20mm 48mil
10 layers 1.60mm 64mil
4
Min trace Width
0.075mm 3mil
5
Min conductor spacing
0.075mm 3mil
6
Min hole diameter
0.20mm 8mil
7
PTH wall thickness
0.025mm 1mil
8
PTH hole dia. tolerance
±0.10mm 4mil
9
Non PTH hole dia. tolerance
±0.05mm 2mil
10
Hole position deviation
±0.05mm 2mil
11
Dimensional tolerance
±0.10mm 4mil
12
Min solder bridge
0.10mm 4mil
13
Twist and Bow
≤1.0%
14
Insulation Resistance
＞1012Ω Normal
15
Through hole resistance
＜300Ω Normal
16
Dielectric strength
＞1.3KV/mm
17
Current resistance
10A
18
Peel resistace stregth
1.4N/mm
19
Soldermask abrasion
＞6H
20
Thermal shock
288℃ 20Sec
21
Non-flmmability
94V-0
22
O/S test Voltage
50~300V
 
     
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